AM3D Audio Enhancement Ported to Tensilica's HiFi Audio DSPs
SANTA CLARA, Calif. USA and AALBORG, Denmark - February
25, 2013 -Tensilica®, Inc. and AM3D A/S today announced
that the two companies have extended their partnership to port
AM3D's Audio Enhancement product to Tensilica's family of HiFi
Audio DSPs. This will provide enhanced audio experiences for
mobile phones, in-car entertainment, home entertainment systems and
AM3D Bass Enhancement and Transducer Equalization provide a
highly noticeable boost to the audio performance and AM3D Virtual
Surround Sound creates a profound sound image that extends beyond
the physical loudspeakers. The solution is purely software-based
and all features have very low memory footprint and CPU
"A number of our customers have asked for superior audio
enhancement solutions. AM3D offers magnificent audio enhancement
with a natural timbre and an intense bass, and this optimized set
of features will soon be available for our customers," stated Larry
Przywara, Tensilica's senior director of mobile multimedia.
"Tensilica's HiFi Audio/Voice DSP cores have become the favorite
among many of our partners. We believe that our expanded
relationship will make a difference in maintaining the successes
for both AM3D and Tensilica," stated Jacob N. Andersen, Senior Vice
President, AM3D A/S.
The complete port of AM3D's Audio Enhancement software will be
available in the second quarter of 2013.
About AM3D A/S
AM3D A/S provides world-class audio technology. AM3D delivers
software solutions for audio enhancement and 3D audio for mobile
phones and other portable devices, in-car and home entertainment
systems and for mission-critical applications. We hold several
patents on audio technologies. Visit www.am3d.com.
Tensilica, Inc. is the leader in dataplane processor IP cores with
over 200 licensees.
Dataplane processors (DPUs) combine the best capabilities of DSPs
and CPUs while delivering 10 to 100x the performance because they
can be optimized using Tensilica's automated design tools to meet
specific and demanding signal processing performance targets.
Tensilica's DPUs power SOC designs at system OEMs and seven out of
the top 10 semiconductor companies for designs in mobile wireless,
telecom and network infrastructure, computing and storage, and home
and auto entertainment. Tensilica offers standard cores and
hardware/software solutions that can be used as is or easily
customized by semiconductor companies and OEMs for added
differentiation. For more information on Tensilica's patented,
benchmark-proven DPUs visit www.tensilica.com.
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Tensilica is a registered trademark belonging to Tensilica, Inc.
All other company and product names mentioned are trademarks and/or
registered trademarks of their respective owners.